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Int. J. Electroactive Mater. 5 (2017) 50-55

Selective Electrochemical Etching of the Sn-3.0Ag-0.5Cu Solder Alloy by Chronoamperometry

Muhamad Zamri Yahaya*, Ahmad Azmin Mohamad

School of Materials and Mineral Resources Engineering, University Science Malaysia, Nibong Tebal, Penang, Malaysia
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Abstract : Detailed morphological observation of the Sn-3.0Ag-0.5Cu solder alloy were achieved by the aid of electrochemical etching. The removal of the β-Sn phase were conducted at a fixed potential of -350 mV. The etched solder were subsequently investigated by the phase, structural, morphological and elemental analysis. Stable current responses at 0.00222 A were recorded for the etched Sn-3.0Ag-0.5Cu. The phase analysis reflects the selective removal of the β-Sn. Other phases of the Cu6Sn5, Ag3Sn and SnSO4 were also obtained by the etched Sn-3.0Ag-0.5Cu. The 120 s etching duration was observed to sufficiently remove the β-Sn phase for accurate observation on the IMC phases. Minor detection of SnSO4 by-product were detected near the solder/substrate interface region. The removal of the β-Sn through electrochemical etching allow in-depth morphological acquisition and observation on the resultant IMC phases. Clear and accurate shape profile of the IMC phases were clearly obtained in comparison the un-etched Sn-3.0Ag-0.5Cu solder alloy.

Keywords : SAC305,Morphology,Selective Electrochemical Etching