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Int. J. Electroactive Mater. 7 (2019) 7-13

Microstructure Evaluation of Sn-3Ag-0.5Cu Solder Alloy during Cyclic Voltammetry Analysis

Ibrahym Ahmad*, Ahmad Azmin Mohamad

School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Parit Buntar, Perak, Malaysia
*Email Address : This email address is being protected from spambots. You need JavaScript enabled to view it.

Abstract : Cyclic voltammetry (CV) characterization was performed on SAC305 to study its electrochemical dissolution behaviour. Microstructure evaluation via scanning electron microscope was performed at different time instances by stopping the CV at certain points along the curves for verification of dissolution behaviour. Electrochemical dissolution of intermetallic compound will proceed only when β-Sn is completely dissolved from the sample. Re-deposition of Sn from the electrolyte is also observed during cathodic scan. The Sn deposits will later be re-dissolved back from the sample during the second anodic scan.

Keywords : SAC Solder alloys,intermetallic compounds,anodic dissolution,electrochemical etching,cyclic voltammetry,