Download full article : PDF
Int. J. Electroactive Mater. 6 (2018) 28-35


Nur Syamira Sa’don1, Nordarina Jumali2, Muhammad Firdaus Mohd Nazeri3*

1School of Materials Engineering, , Universiti Malaysia Perlis, Arau, Perlis, Malaysia
2School of Materials Engineering , Universiti Malaysia Perlis, Arau, Perlis, Malaysia
3Materials Engineering, Universiti Malaysia Perlis, Arau, Perlis, Malaysia

*Email Address : This email address is being protected from spambots. You need JavaScript enabled to view it.

Abstract : The present study investigates the effect of Al additions on corrosion and thermal behavior of Sn-Zn based solder. The corrosion properties of binary Sn-Zn and ternary Sn-Zn-Al solders were studied in 6 M KOH solution. The effect of adding Al on the thermal properties also was investigated. Collective evidences showed reduction in melting temperature and pasty range temperature were obtained for the Sn-Zn-Al, indicating improved thermal properties. However, slight Zn-rich grain enlargement reduced the corrosion resistance. Poor passivation film formation on the surface of solder due to the addition of Al also helped in reducing the protection of the surface from further corrosion attack. This modification in adding Al to Sn-9Zn deemed gives mixed effects and other alternative steps in improving the overall reliability concerns on Sn-9Zn solder should be additionally explored in the future.

Keywords : Corrosion; ,Solder; ,Sn-Zn; ,Sn-Zn-Al; ,Alkaline solution,