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Int. J. Electroactive Mater. 5 (2017) 56-61


Nurwahida Mohd Zaini1, Mukridz Md Mohtar1, Ahmad Azmin Mohamad2, Muhammad Firdaus Mohd Nazeri3*

1School of Materials Engineering, UniMAP, Arau, Perlis, Malaysia
2School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Nibong Tebal, Penang, Malaysia
3Materials Engineering, Universiti Malaysia Perlis, Arau, Perlis, Malaysia

*Email Address : This email address is being protected from spambots. You need JavaScript enabled to view it.

Abstract : The use of Sn-3.0Ag-0.5Cu (SAC305) solder on electronic products requires assured reliability information, including corrosion resistant capabilities since the demand for device miniaturization and portability are keep increasing. To achieve this, the corrosion properties of SAC305 were evaluated in 6 M KOH by means of potentiodynamic polarization. To further understand the electrochemical reaction taking place, additional characterizations such as X-ray diffraction and scanning electron microscope analyses were performed. Lowest equilibrium corrosion potential and passivation current were obtained at the scan rate of 1 mV/s. Passivation film was seen at the surface of the solder after polarization, resulted from dissolution of Sn. Phase identification revealed that SnO and SnO2 were the responsible phases for the formation of passivation.

Keywords : Corrosion,Lead-Free Solder,SAC305,Phase,Microstructure,